삼성 20nm 8Gb DDR4 메모리 칩 양산시작

Samsung has begun mass-producing 20nm 8Gb DDR4 memory chips. This will lead to 32GB RAM modules for enterprise level computing requirements.

(Image source: Samsung via BusinessWire)

 

With its new 8Gb DDR4 technology, Samsung stated that it “began manufacturing 32GB registered dual in-line memory module (RDIMM) earlier this month.” The data transfer rate per pin is rated up to 2,400Mbps; in comparison, a typical DDR3 server memory module has a bandwidth of 1,866Mbps. This translates to a performance gain of about 23%. In addition, Samsung aims to produce high-density RAM modules of up to 128GB through the use of 3D through-silicon via (TSV) technology. The new RAM modules touts power efficiency with its operating voltage of 1.2V, and “improved error correction features.” The company has also incorporated its 20nm fabrication process for its desktop 4Gb DDR3 modules, and 6Gb LPDDR3 modules for mobile devices.